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Sunway joins FiRa Consortium


Shenzhen, China -(Oct. 28, 2020)- Sunway Communication has joined the international, US headquartered organization FiRa™ Consortium. The organization was founded in August 2019 by HID Global, Bosch, NXP Semiconductors, and Samsung. Since then, several other industry leaders have further solidified the consortium through their memberships. It is the most authoritative organization in the UWB (Ultra-Wideband) industry, driving the industry by setting standards and certifications to ensure an interoperable UWB ecosystem. Organization contributions come from key stakeholders from chipset and device manufacturers to system integrators, service and technology providers, test tool developers, test labs, and academics.


UWB has found new relevance in its present form as a secure fine ranging technology. UWB technology can accurately achieve centimeter scale ranging and positioning. When Apple introduced the iPhone 11 in 2019 with its integrated UWB chip, attention turned to UWB with major vendors aggressively developing products supporting this future mainstream technology. Samsung also recently included UWB in its Galaxy Note20 Ultra and Galaxy Z Fold2 devices, enabling several new use cases.


Sunway Communication has conducted in-depth research in UWB, progressed into product development, and is now actively working with chip manufacturers to develop IoT modules with UWB function. Sunway Communication joining the FiRa Consortium represents not only a formalized industry collaboration, but also the encouragement of further UWB development of Sunway. As a member of FiRa, Sunway will work together with UWB upstream and downstream ecosystem partners to take full advantage of opportunities offered by this technology and leverage its unique advantages, hence further enhancing development speed of the industry.


About Sunway Communication

Sunway Communication is a world leading provider of RF connectivity related and other performance-critical components and modules. The company involves in all stages of the product value chain: research, development, sales and manufacturing. The parent company, Shenzhen Sunway Communication Co., Ltd, was established in April 2006 and was listed on the Shenzhen Stock Exchange in November 2010 (stock code: 300136). Products developed by Sunway include antennas, wireless charging modules, EMC/EMI solutions, cables, transmission lines and connectors, RF front-end components, and audio/RF modules, which are manufactured using precision metals, 3-D MID, molding, complex assembly and many other key processes.


About FiRa Consortium

Headquartered in Beaverton, OR, the FiRa Consortium is a member-driven organization dedicated to the development and widespread adoption of seamless user experiences using the secured fine ranging and positioning capabilities of Ultra-Wideband (UWB) technologies. To learn more about the FiRa Consortium, visit: http://www.firaconsortium.org.


For additional information or the name of your nearest representative:


Sunway Communication                                                 FiRa Consortium

Phone               +86 - 755 8177 3388                               +1 503 619 5932
Internet            www.sz-sunway.com                                www.firaconsortium.org

E-mail               marketing@sz-sunway.com                    press@firaconsortium.org

LinkedIn           Sunway Communication                          FiRa Consortium


© 2020 FiRa Consortium. All rights reserved. FiRa, FiRa Consortium, the FiRa logo, the FiRa Certified logo, and FiRa tagline are trademarks or registered trademarks of FiRa Consortium or its licensor(s)/supplier(s) in the US and other countries and may not be used without permission. All other trademarks, service marks, and product or service names are trademarks or registered trademarks of their respective owners.

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